RUIXIONG

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Picosecond UV Laser Cutting Machine

Category：

Laser Cutter

INQUIRY
  • Product Description

  • product description

    Ultrashort pulse ultraviolet picosecond laser processing equipment
    Picosecond ultraviolet laser cutting machine is suitable for ultra-thin metal materials (copper, gold, silver, aluminum, titanium, nickel, stainless steel, molybdenum, etc.), flexible materials (PET, PI, PP, PVC , Teflon, electromagnetic film, adhesive film, etc.), graphene, carbon fiber, silicon wafer, ceramics, FPC and other materials cutting, drilling, surface microstructure (bionic structure), scribing, groove processing, and polymer
    Picosecond UV laser cutting machine for micro-processing of materials and composite materials is suitable for ultra-thin metal materials (copper, gold, silver, aluminum, titanium, nickel, stainless steel, molybdenum, etc.), flexible materials (PET, PI, PP, PVC, iron Teflon, electromagnetic film, adhesive film, etc.), graphene, carbon fiber, silicon wafer, ceramics, FPC and other materials cutting, drilling, surface microstructure (bionic structure), scribing, groove processing, and polymer materials, Micromachining of composite materials. The equipment has a wide range of uses and wide applicability. It can realize micro-processing on the surface of various types of materials, and can customize the control of depth and width.


    Product features
    1. Using picosecond ultraviolet laser, ultra-short pulse ultraviolet cold laser processing has almost no heat conduction, suitable for high-speed cutting, etching, scribing, grooving, and drilling of any organic & inorganic materials, with a minimum chipping of 3 μm edges and heat-affected zone.
    2. CCD visual pre-scanning & automatic target positioning processing, importing drawings for automatic processing, easy and fast operation.
    3. Excellent beam quality, good long-term working stability, and negligible thermal influence.
    4. Higher single pulse energy, higher processing accuracy, can realize fine processing of almost any solid material.
    5. Excellent processing flexibility, can carry out fine cutting of any shape, including arcs, straight lines, oblique lines, etc.
    6. The self-developed software control system can customize and upgrade various functions according to customer requirements, and configure single-head or double-head work according to requirements.
     

    Applied materials and fields
    Applied materials: various types of ultra-thin metals, non-metallic films, graphene, ink removal/etching, carbon fiber, silicon wafers, ceramics, FPC, PI, PET, PVC, Teflon and other material processing, and some Micromachining of polymer materials and composite materials.
    Application areas: university research field, biological imitation structure, semiconductor electronics, aerospace, automobile, biomedicine, etc.

     

    Technical Parameters

    project

    parameter

    laser type

    355nm Picosecond UV Laser

    Processing range

    500*400mm (can be customized)

    focusing lens

    40*40mm/15*15mm (can be customized)

    focus spot

    5μm (depending on the material)

    Minimum tangent width

    <10μm (depending on the material)

    Processed product thickness

    ≤1.5mm (depending on the material)

    Scanning speed of galvanometer

    ≤4000mm/s

    Platform moving speed

    500mm/s

    Table positioning accuracy

    ±2μm

    Table repeatability

    ±1μm

    Handled file formats

    Standard Gerber files, DXF files, PLT files, etc.

     

    cutting effect

     

     

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